DocumentCode
3423083
Title
Thermal analysis based on the environmental tests of STN display
Author
Li, Jian-Ping ; Yang, Ping ; Zhong, Jian ; Chen, Quayle ; Jing, Cherie ; Xu, Leon ; Salo, Antti
Author_Institution
Sch. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2009
fDate
26-29 April 2009
Firstpage
1
Lastpage
6
Abstract
Environmental test is widely used to verify the adaptability and reliability of various electronic products in the last decades. The sharp change of temperature and humidity in certain situations could pose a serious reliability issue on the electronic components. This paper presents an experimental study of one kind of plastic substrate based flexible display called STN (super-twisted nematic). The study focuses on the reliability of display under various temperature and humidity conditions. Considering the range of temperature and humidity changed in applications, the experiments are divided into four subgroups: cold test, cyclic damp heat test, the steady state damp heat test and dry heat test. Through all the tests, the STN display reliability was evaluated and the failure modes were obtained. Based on these tests, the thermal-structural simulation model was built. By the simulation, part of the experiment phenomenon were explained. It provides a solid foundation for further reliability study of the STN display in the practical applications.
Keywords
environmental testing; liquid crystal displays; nematic liquid crystals; reliability; thermal analysis; STN display; adaptability; cold test; cyclic damp heat test; dry heat test; environmental test; failure modes; flexible display; reliability; steady state damp heat test; super-twisted nematic; thermal analysis; thermal-structural simulation model; Electronic equipment testing; Glass; Humidity; Liquid crystal displays; Material storage; Plastics; Steady-state; Substrates; Temperature distribution; Thin film transistors; Environmental Test; FEA; Reliability; STN;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location
Delft
Print_ISBN
978-1-4244-4160-0
Electronic_ISBN
978-1-4244-4161-7
Type
conf
DOI
10.1109/ESIME.2009.4938420
Filename
4938420
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