Title :
Sensitivity analysis of technological fabrication tolerances on the lifetime of flip-chip solder joints
Author :
Eckert, Tilman ; Tetzner, Kornelius ; Bochow-Ness, Olaf ; Müller, Wolfgang H. ; Reichl, Herbert
Author_Institution :
Tech. Univ. Berlin, Berlin
Abstract :
In this paper we discuss the influence of solder joint geometry on the lifetime of a flip chip assembly. Geometry variations caused by variations of solder volume, pad configuration, and pad size on the printed circuit board (PCB) were taken into account. Typically these parameters vary due to technological fabrication tolerances. Consequently, the influence of such design aspects on system reliability was studied in detail by using finite element analysis (FEA) models. Selected solder joint geometry variations were assembled and tested in a thermal cycling chamber. Simulation and experimental results were compared and some advice is given regarding their evaluation.
Keywords :
assembling; chip scale packaging; finite element analysis; flip-chip devices; life testing; printed circuit manufacture; sensitivity analysis; solders; tolerance analysis; electronic packaging; finite element analysis model; flip chip assembly; flip-chip solder joints; printed circuit board; sensitivity analysis; system reliability; technological fabrication tolerances; thermal cycling chamber; Assembly; Fabrication; Finite element methods; Flip chip; Flip chip solder joints; Geometry; Printed circuits; Reliability; Sensitivity analysis; Soldering;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938427
