• DocumentCode
    3423242
  • Title

    Modelling of jet-impingement cooling for power electronics

  • Author

    Rizvi, M.J. ; Skuriat, R. ; Tilford, T. ; Bailey, C. ; Johnson, C.M. ; Lu, H.

  • Author_Institution
    Sch. of Comput. & Math. Sci., Univ. of Greenwich, London
  • fYear
    2009
  • fDate
    26-29 April 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The use of an innovative jet impingement cooling system in a power electronics application is investigated using numerical analysis. The jet impingement system, outlined by Skuriat et al, consists of a series of cells each containing an array of holes. Cooling fluid is forced through the device, forming an array of impingement jets. The jets are arranged in a manner, which induces a high degree of mixing in the interface boundary layer. This increase in turbulent mixing is intended to induce higher Nusselt numbers and effective heat transfer coefficients. Enhanced cooling efficiency enables the power electronics module to operate at a lower temperature, greatly enhancing long-term reliability. The results obtained through numerical modelling deviates markedly from the experimentally derived data. The disparity is most likely due to the turbulence model selected and further analysis is required, involving evaluation of more advanced turbulence models.
  • Keywords
    cooling; jets; numerical analysis; power electronics; Nusselt numbers; cooling fluid; enhanced cooling efficiency; heat transfer coefficient; innovative jet impingement cooling system; interface boundary layer; numerical analysis; numerical modelling; power electronics application; power electronics module; turbulence model; turbulent mixing; Electronics cooling; Geometry; Insulated gate bipolar transistors; Numerical analysis; Power electronics; Power system control; Power system modeling; Spraying; Temperature; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
  • Conference_Location
    Delft
  • Print_ISBN
    978-1-4244-4160-0
  • Electronic_ISBN
    978-1-4244-4161-7
  • Type

    conf

  • DOI
    10.1109/ESIME.2009.4938428
  • Filename
    4938428