Title :
A 32-channel active high density connector for biomedical applications
Author :
Nikles, S. ; Najafi, Khalil ; Bledsoe, Sandy ; Bradley, Robert M.
Author_Institution :
Center for Wireless Integrated Microsystems (WIMS), Michigan Univ., Ann Arbor, MI, USA
fDate :
30 Jan.-3 Feb. 2005
Abstract :
A 32-channel micromachined connector with active buffers for use with implanted neural recording probes has been fabricated and tested. The connector operates by lowering an array of micromachined polyimide cantilever beams onto a corresponding array of gold bumps on the probe back end. The connector has a footprint of 5.9×5.1mm2 and a height of 5.1mm, small enough to fit on a rat skull. Reliability characterization of the connector was performed by repeated connection/disconnection cycles. Testing showed that electrical contacts were formed 99.6% of the time. Electrical characterization has determined the average contact resistance for each channel is 205mΩ at 1kHz and the cross-talk between channels is -51.5dB. RMS noise for the entire connector assembly from 100-10,000Hz is 53.4μV.
Keywords :
biomedical electronics; biomedical equipment; buffer circuits; contact resistance; electric connectors; electrical contacts; micromachining; 1 kHz; 205 mohm; 32-channel active high density connector; 5.1 mm; 53.4 muV; RMS noise; active buffers; biomedical applications; contact resistance; crosstalk; electrical contacts; gold bumps; micromachined polyimide cantilever beams; neural recording probes; rat skull; repeated connection cycle; repeated disconnection cycle; Assembly; Connectors; Contact resistance; Crosstalk; Gold; Polyimides; Probes; Skull; Structural beams; Testing;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1453996
