• DocumentCode
    3423994
  • Title

    Efficient solution of inverse thermal problem via parametric model order reduction

  • Author

    Bechtold, Tamara ; Hohlfeld, Dennis ; Rudnyi, Evgenii B.

  • Author_Institution
    MCRTN COMSON, Univ. of Wuppertal, Wuppertal
  • fYear
    2009
  • fDate
    26-29 April 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper we present a novel approach to determine material thermal properties of thin film materials. As a test case we have chosen silicon nitride employed in a micro-hotplate structure. We use ANSYS to build a three-dimensional finite element (FE) model of the test structure, which considers heat conduction and convection effects. It is further parameterized and subjected to parametric model order reduction (pMOR). The parameters of the reduced model are the unknown material thermal properties and the heat transfer coefficient, which are automatically adjusted within the optimization loop, so that the simulation results of the model are in agreement with the transient temperature measurements. The use of parameterized reduced order models within the optimization iterations speeds up the transient solution time by several orders of magnitude, while retaining almost the same precision as the full FE model.
  • Keywords
    finite element analysis; heat conduction; heat transfer; optimisation; reduction (chemical); silicon compounds; thin films; SiN; convection; heat conduction; heat transfer coefficient; inverse thermal problem; material thermal property; microhotplate structure; optimization loop; parametric model order reduction; silicon nitride; thin film materials; three-dimensional finite element model; transient temperature measurements; Biomembranes; Conducting materials; Fabrication; Materials testing; Micromechanical devices; Numerical models; Parametric statistics; Resistors; Silicon; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
  • Conference_Location
    Delft
  • Print_ISBN
    978-1-4244-4160-0
  • Electronic_ISBN
    978-1-4244-4161-7
  • Type

    conf

  • DOI
    10.1109/ESIME.2009.4938461
  • Filename
    4938461