DocumentCode
3424237
Title
Modelling of Sn3.0Ag0.5Cu thermo-mechanical behaviour by a continuum damage approach
Author
Grieu, Marc ; Massiot, Gregor ; Maire, Olivier ; Munier, Catherine ; Bienvenu, Yves ; Renard, Jacques
Author_Institution
EADS France Innovation Works, Suresnes
fYear
2009
fDate
26-29 April 2009
Firstpage
1
Lastpage
6
Abstract
A continuum damage model is proposed for Sn3.0Ag0.5Cu solder alloy in pure shear conditions. Experimental tests were performed on specific torsion samples to adjust material parameters of the continuum damage model. The main advantage of this method is to introduce damage process in the mechanical behaviour law of SnAgCu solder. Damage process highly affects the mechanical behaviour of solder alloy during thermal cycle fatigue. Thus, the lifetime of solder can be estimated by using this model without the determination of fatigue laws.
Keywords
copper alloys; silver alloys; solders; thermal stress cracking; thermomechanical treatment; tin alloys; torsion; SnAgCu; continuum damage approach; solder alloy; thermal cycle fatigue; thermomechanical behaviour; torsion; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location
Delft
Print_ISBN
978-1-4244-4160-0
Electronic_ISBN
978-1-4244-4161-7
Type
conf
DOI
10.1109/ESIME.2009.4938471
Filename
4938471
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