• DocumentCode
    3424540
  • Title

    The dynamic model of electrostatic torsion mirror with pull-in consideration for multiphysics behavior anticipation

  • Author

    Yi, Yuheon ; Fujita, Hiroyuki ; Toshiyoshi, Hiroshi

  • Author_Institution
    Inst. of Ind. Sci., Univ. of Tokyo, Tokyo
  • fYear
    2009
  • fDate
    26-29 April 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This study presents a newly developed dynamic model established by MATLAB Simulink that can handle post pull-in behavior of MEMS electrostatic torsional mirror. In addition to the conventional MATLAB Simulink model of the quadratic oscillation system, a mathematical model of displacement limiter has been inserted to represent the pull-in effect in dynamic analysis. Due to the modification, the model has become applicable to both pre- and post pull-in region of electrostatic actuators. Electrical circuits from the MATLAB Simulink library can be combined with the mechanical model and simulated to see multiphysics behavior. The new model has been integrated in the simulation model of self-oscillating MEMS system which has CMOS logics, and the versatility in the behavior-level simulation has been verified.
  • Keywords
    CMOS integrated circuits; circuit oscillations; micromechanical devices; oscillators; CMOS logics; MATLAB Simulink library; MATLAB Simulink model; MEMS electrostatic torsional mirror; behavior-level simulation; complementary metal-oxide-semiconductor; displacement limiter; dynamic analysis; dynamic model; electrical circuits; electrostatic actuators; electrostatic torsion mirror; mathematical model; mechanical model; microelectromechanical system; multiphysics behavior anticipation; pull-in consideration; quadratic oscillation system; self-oscillating MEMS system; simulation model; versatility; Analytical models; CMOS image sensors; CMOS logic circuits; Circuit simulation; Electrostatic actuators; MATLAB; Mathematical model; Micromechanical devices; Mirrors; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
  • Conference_Location
    Delft
  • Print_ISBN
    978-1-4244-4160-0
  • Electronic_ISBN
    978-1-4244-4161-7
  • Type

    conf

  • DOI
    10.1109/ESIME.2009.4938488
  • Filename
    4938488