Title :
Two-dimensional digital microfluidic system by multilayer printed circuit board
Author :
Gong, Jian ; Kim, Chang-Jin C J
Author_Institution :
Dept. of Mech. & Aerosp. Eng., California Univ., Los Angeles, CA, USA
fDate :
30 Jan.-3 Feb. 2005
Abstract :
We report a true 2D (i.e., direct physical access to each electrode in a M×N grid) electrowetting-on-dielectric (EWOD) chip for the first time by adopting a multilayer printed circuit board (PCB) as the substrate. Incorporating mature PCB technology and introducing land grid array (LGA) sockets in the packaging, this new fabrication scheme is expected to make reconfigurable digital microfluidics practical in terms of chip cost (i.e., low enough to be disposable) and system flexibility (i.e., scalable).
Keywords :
cellular arrays; integrated circuit packaging; microfluidics; printed circuits; wetting; 2D digital microfluidic system; PCB technology; chip cost; electrode; electrowetting-on-dielectric chip; integrated circuit packaging; land grid array sockets; multilayer printed circuit board; reconfigurable digital microfluidics; substrate; system flexibility; Aerospace engineering; Costs; Dielectrics; Electrodes; Fabrication; Microfluidics; Packaging; Printed circuits; Telephony; Wiring;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1454032
