DocumentCode
3424577
Title
Two-dimensional digital microfluidic system by multilayer printed circuit board
Author
Gong, Jian ; Kim, Chang-Jin C J
Author_Institution
Dept. of Mech. & Aerosp. Eng., California Univ., Los Angeles, CA, USA
fYear
2005
fDate
30 Jan.-3 Feb. 2005
Firstpage
726
Lastpage
729
Abstract
We report a true 2D (i.e., direct physical access to each electrode in a M×N grid) electrowetting-on-dielectric (EWOD) chip for the first time by adopting a multilayer printed circuit board (PCB) as the substrate. Incorporating mature PCB technology and introducing land grid array (LGA) sockets in the packaging, this new fabrication scheme is expected to make reconfigurable digital microfluidics practical in terms of chip cost (i.e., low enough to be disposable) and system flexibility (i.e., scalable).
Keywords
cellular arrays; integrated circuit packaging; microfluidics; printed circuits; wetting; 2D digital microfluidic system; PCB technology; chip cost; electrode; electrowetting-on-dielectric chip; integrated circuit packaging; land grid array sockets; multilayer printed circuit board; reconfigurable digital microfluidics; substrate; system flexibility; Aerospace engineering; Costs; Dielectrics; Electrodes; Fabrication; Microfluidics; Packaging; Printed circuits; Telephony; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-8732-5
Type
conf
DOI
10.1109/MEMSYS.2005.1454032
Filename
1454032
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