Title :
The needs of multi-scale/multi-physics simulation for RF Power packaging/product development
Author :
Yuan, Cadmus ; Zhang, G.Q. ; Salta, Joey ; Jos, Rik
Author_Institution :
NXP Semicond.
Abstract :
High power RF transmitters are essential components for enabling base stations, microwave, and broadcast systems. NXP is a leading RF Power supplier for more than 25 years, and our market share gain with volume. In principle, the market demands high power, high frequency and high efficiency with low thermal resistance: Efficiency larger than 30%, frequency in range of 0.7-2.5 GHz or higher, which results in the power dissipation approximately -200 W. To ensure the device/system is working properly, the junction temperature at silicon surface is required less than ~150 degC, to ensure the product performance.
Keywords :
MOS integrated circuits; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; power integrated circuits; product development; radiofrequency integrated circuits; thermal resistance; NXP LDMOS technology; RF packaging; RF power packaging; heat dissipation efficiency; multiphysics simulation; multiscale simulation; product development; reliability; seventh generation laterally diffused metal oxide semiconductor; thermal resistance; Base stations; Broadcasting; Packaging; Power dissipation; Power supplies; Product development; Radio frequency; Surface resistance; Thermal resistance; Transmitters;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938497
