• DocumentCode
    3424939
  • Title

    Co-design and multi-physics analysis for power electronic modules

  • Author

    Bailey, C. ; Lu, H. ; Tilford, T. ; Rizvi, J. ; Yin, C.

  • Author_Institution
    Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London
  • fYear
    2009
  • fDate
    26-29 April 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for power electronics models.
  • Keywords
    design of experiments; failure analysis; hardware-software codesign; power electronics; thermal management (packaging); design of experiments; failure analysis; hardware-software codesign; multi-physics analysis; power electronic module; thermal management; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Fatigue; Multichip modules; Power electronics; Semiconductor device packaging; Soldering; Thermal management; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
  • Conference_Location
    Delft
  • Print_ISBN
    978-1-4244-4160-0
  • Electronic_ISBN
    978-1-4244-4161-7
  • Type

    conf

  • DOI
    10.1109/ESIME.2009.4938505
  • Filename
    4938505