DocumentCode
3424939
Title
Co-design and multi-physics analysis for power electronic modules
Author
Bailey, C. ; Lu, H. ; Tilford, T. ; Rizvi, J. ; Yin, C.
Author_Institution
Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London
fYear
2009
fDate
26-29 April 2009
Firstpage
1
Lastpage
4
Abstract
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a multi-physics and multi-disciplinary approach to accurately capture the influences of all the constraints. These can include electro-magnetic, thermal, and mechanical in terms of understanding radiation, thermal management and reliability of the final package. This paper will discuss some of the latest advances in multi-physics & multi-disciplinary design for power electronics models.
Keywords
design of experiments; failure analysis; hardware-software codesign; power electronics; thermal management (packaging); design of experiments; failure analysis; hardware-software codesign; multi-physics analysis; power electronic module; thermal management; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Fatigue; Multichip modules; Power electronics; Semiconductor device packaging; Soldering; Thermal management; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location
Delft
Print_ISBN
978-1-4244-4160-0
Electronic_ISBN
978-1-4244-4161-7
Type
conf
DOI
10.1109/ESIME.2009.4938505
Filename
4938505
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