Title :
Applications of FE multi-scale simulations in microelectronics
Author :
van Silfhout, R. ; Viegers, Thijs
Author_Institution :
Philips Appl. Technol., Eindhoven
Abstract :
This paper discusses challenges for multi-scale Finite Element (FE) modeling in microelectronics. Its miniaturization and multi-scale nature is an enabler for in Healthcare and Well-being markets. Function integration and miniaturization enable microelectronic products having functionalities such as rollable display (Figure 1), wireless connectivity & GPS, beaming, illumination systems, body health sensor, DNA analyzer, and many many more. For multi-scale FE modeling, their added value could be in preventing reliability problems and enabling faster functionality integrations in microelectronics resulting in shorter time to market and lower cost.
Keywords :
finite element analysis; integrated circuit interconnections; integrated circuit reliability; DNA analyzer; FE multiscale simulations; GPS; beaming; body health sensor; finite element modeling; function integration; healthcare markets; illumination systems; microelectronics; miniaturization; rollable display; well-being markets; wireless connectivity; DNA; Displays; Finite element methods; Global Positioning System; Iron; Lighting; Medical services; Microelectronics; Sensor systems; Wireless sensor networks;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938514
