Title :
Comparative life cycle assessment (LCA) of modern interconnection techniques for printed board assemblies
Author :
Hedemalm, Per ; Segerberg, Tomas
Author_Institution :
IVF, Sweden
Abstract :
By Life Cycle Assessment (LCA) we will here mean a method to take into account the environmental burdens of a product already in the design stage. To exemplify LCA for electronic products, we have chosen to compare three different interconnection techniques: ordinary Surface Mount Technology (SMT), Chip-on-Board (COB) using gold wire bonding, and Flip-Chip using eutectic soldering. In this analysis, we have included raw materials production and use
Keywords :
environmental factors; flip-chip devices; lead bonding; printed circuit manufacture; surface mount technology; chip-on-board; electronic product; environmental burden; eutectic soldering; flip-chip; gold wire bonding; interconnection; life cycle assessment; printed board assembly; raw materials; surface mount technology; Bonding; Consumer electronics; Design methodology; Gold; Production; Raw materials; Soldering; Surface-mount technology; Waste materials; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541030
