• DocumentCode
    3426949
  • Title

    Etching technology for microchannels

  • Author

    Tjerkstra, R. Willem ; De Boer, Meint ; Berenschot, Erwin ; Gardeniers, J.G.E. ; van den Berg, Albert ; Elwenspoek, Miko

  • Author_Institution
    MESA Res. Inst., Twente Univ., Enschede, Netherlands
  • fYear
    1997
  • fDate
    26-30 Jan 1997
  • Firstpage
    147
  • Lastpage
    152
  • Abstract
    Various ways of fabricating channels in silicon are discussed. Some new channels are presented: the GPSICs and the LPCVD covered channels. Also some attention is paid to the problem of making connections of these channels to the outside world
  • Keywords
    elemental semiconductors; etching; micromechanical devices; plasma CVD coatings; silicon; wafer bonding; LPCVD covered channels; Si; Si etching; ground plate supported insulating channels; laser induced etching; layer deposition; microchannels; wafer bonding; Anisotropic magnetoresistance; Dry etching; Joining processes; Laboratories; Magnetic heads; Microchannel; Shape; Silicon; Wafer bonding; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
  • Conference_Location
    Nagoya
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-3744-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1997.581790
  • Filename
    581790
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3426949