DocumentCode
3427038
Title
Development of Sn-Pb-Bi solder materials for fine pitch package
Author
Yamamoto, Ken Ichi ; Lee, Chahn ; Shimokawa, Hanae ; Ishida, Toshiharu ; Soga, Tasao
Author_Institution
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
fYear
1995
fDate
4-6 Dec 1995
Firstpage
232
Lastpage
235
Abstract
This paper describes a new solder which is less likely to result in solder bridging. In this research, it was clarified that the bridging was related with surface tension and temperature difference of solidus and liquidus at a solder composition. We have selected 53Sn-2Bi-45Pb solder from results of experiment. Bridging occurrence rate of this solder is less than 1/10 of 63Sn-37Pb solder in cases of 0.5 mm and 0.3 mm pitch QFPs soldering
Keywords
bismuth alloys; fine-pitch technology; integrated circuit packaging; lead alloys; soldering; surface tension; tin alloys; 0.3 mm; 0.5 mm; QFP; Sn-Pb-Bi; bridging; fine pitch package; liquidus; solder composition; solidus; surface tension; temperature difference; Copper; Electronics packaging; Lead; Mechanical factors; Pins; Printed circuits; Reflow soldering; Semiconductor materials; Temperature; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location
Omiya
Print_ISBN
0-7803-3622-4
Type
conf
DOI
10.1109/IEMT.1995.541033
Filename
541033
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