DocumentCode
3427699
Title
Do current technology trends enforce a paradigm shift in the industrial automation market?
Author
Kopetz, H.
Author_Institution
Inst. fur Tech. Inf., Tech. Univ. Wien, Austria
Volume
2
fYear
1999
fDate
1999
Firstpage
1557
Abstract
The advances of the semiconductor industry enable the implementation of complete computer systems on a single silicon die and the integration of MEMS sensors, signal conditioning logic and network access into a smart sensor node. The consequences of these trends, both technical and economical, lead to qualitative changes in the environment of the system engineer. In the future, system development will be concerned on one hand with the design and test of robust COTS subsystems and on the other hand with the constructive integration of these COTS subsystems into larger application systems. In such a changed world the precise specification of the interfaces between the subsystems, both in the value domain and temporal domain, is of utmost importance. It is argued that the precise temporal specification of subsystem interfaces is only possible in time-triggered architectures. This is the reason why a paradigm shift from today´s dominating event-triggered real-time architectures to time-triggered real-time architectures is anticipated
Keywords
industrial control; microsensors; real-time systems; COTS subsystems; MEMS sensors; event-triggered real-time architectures; industrial automation; network access; signal conditioning logic; smart sensor node; specification; system development; temporal specification; time-triggered architectures; time-triggered real-time architectures; Computer networks; Electronics industry; Environmental economics; Intelligent sensors; Logic; Micromechanical devices; Sensor systems; Silicon; System testing; Systems engineering and theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Technologies and Factory Automation, 1999. Proceedings. ETFA '99. 1999 7th IEEE International Conference on
Conference_Location
Barcelona
Print_ISBN
0-7803-5670-5
Type
conf
DOI
10.1109/ETFA.1999.813174
Filename
813174
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