• DocumentCode
    3427919
  • Title

    Fabrication of electrophoresis devices on quartz and glass substrates using a bonding with HF solution

  • Author

    Nakanishi, H. ; Nishimoto, T. ; Nakamura, N. ; Nagamachi, S. ; Arai, A. ; Iwata, Y. ; Mito, Y.

  • Author_Institution
    Technol. Res. Lab., Shimadzu Corp., Kyoto, Japan
  • fYear
    1997
  • fDate
    26-30 Jan 1997
  • Firstpage
    299
  • Lastpage
    304
  • Abstract
    Capillary electrophoresis (CE) devices have been fabricated in a small size on quartz or glass substrates. To fabricate a quartz device, we developed a novel bonding method with HF solution. HF-bonding was carried out with 1% HF solution with a pressure of ~40 gf/cm2. With an evaluation of the new bonding method, we confirm that the method ensures enough strength, air tightness and optical property. An advantage of this method is simplicity of bonding process in comparison with a conventional thermal bonding. Using the glass μCE devices, we obtained the original device design and process procedure through our experiments. It was proved that μCE chip permits to apply higher electric power in comparison with the conventional CE system. We show that our design permits to perform quantitative sample injection (several 10 pl or less), effective separation (the number of theoretical plates is over 2500) and high speed analysis (over 10 times as high as the conventional CE system). These features promise an advantage of μCE devices over conventional analytical equipments
  • Keywords
    capillarity; chemical analysis; chemical sensors; electrophoresis; glass; hydrogen compounds; micromechanical devices; quartz; semiconductor technology; HF; HF solution; SiO2; bonding; capillary electrophoresis; electric power; electrophoresis devices; glass substrate; glass substrates; high speed analysis; quantitative sample injection; quartz; thermal bonding; Biomedical optical imaging; Bonding processes; Electrokinetics; Electromagnetic wave absorption; Etching; Fabrication; Fluid flow control; Glass; Hafnium; Performance analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
  • Conference_Location
    Nagoya
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-3744-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1997.581834
  • Filename
    581834