• DocumentCode
    3427960
  • Title

    Valve-less diffuser micropumps fabricated using thermoplastic replication

  • Author

    Olsson, Anders ; Larsson, Olle ; Holm, Johan ; Lundbladh, Lars ; Öhman, Ove ; Stemme, Göran

  • Author_Institution
    Dept. of Signals, Sensors and Syst., R. Inst. of Technol., Stockholm, Sweden
  • fYear
    1997
  • fDate
    26-30 Jan 1997
  • Firstpage
    305
  • Lastpage
    310
  • Abstract
    Here we present the first valve-less diffuser micropumps fabricated using thermoplastic replication. Due to its simple planar geometry the valve-less diffuser pump is very suitable for thermoplastic replication. Two different thermoplastic replication methods have been used: hot embossing and injection molding. As mold inserts we used 0.1 and 0.2 mm deep precision milled brass mold inserts and 20 and 80 μm deep microelectroformed nickel mold inserts defined from deep reactive ion etched (DRIE) silicon wafers. For the injection molding a commercially available Compact Disc injection molding machine (Toolex Alpha MD100) was used to fabricate the diffuser micropumps with extremely short cycle times. One properly fabricated mold insert of nickel can be used to fabricate more than 10000 plastic discs with a cycle time of less than 10 seconds per disc. The plastic material cost is about 5 cents each. Tested pumps reached a maximum volume flow of 1.9 ml/min and a maximum pump pressure of 7.7 kPa
  • Keywords
    elemental semiconductors; micropumps; nickel; silicon; 0.1 to 0.2 mm; 20 mum; 7.7 kPa; 80 mum; Ni deep microelectroformed mold; Si; Si wafers; Toolex Alpha MD100; deep reactive ion etching; hot embossing; injection molding; planar geometry; plastic discs; thermoplastic replication; valve-less diffuser micropumps; Costs; Embossing; Etching; Geometry; Injection molding; Micropumps; Nickel; Plastics; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
  • Conference_Location
    Nagoya
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-3744-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1997.581836
  • Filename
    581836