• DocumentCode
    3428022
  • Title

    Microfluidic plastic capillaries on silicon substrates: a new inexpensive technology for bioanalysis chips

  • Author

    Man, P.E. ; Jones, D.K. ; Mastrangelo, C.H.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1997
  • fDate
    26-30 Jan 1997
  • Firstpage
    311
  • Lastpage
    316
  • Abstract
    This paper reports the fabrication and testing of large-volume plastic capillaries and other fluidic components using a batch lithographic process. These components are fabricated on planar substrates using a simple three mask, low-temperature, IC compatible process that allows the integration of microfluidic and circuit elements. The microfluidic elements are conformal to the substrate thus overcoming the planarization required by bonded structures. In addition they have relatively large volumes in contrast to polysilicon based devices and are completely sealed in a batch manner overcoming the limitations of micromoulding. The capillaries are also optically transparent and can range from 0.5 μm to 100 μm in height. The fluidic components have been fabricated on top of regular silicon, glass, and polycarbonate wafers. Mechanical and biocompatibility tests indicate that the plastic components are suitable for DNA analysis instrumentation
  • Keywords
    DNA; biosensors; capillarity; chemical sensors; elemental semiconductors; fluidic devices; integrated circuit technology; lithography; mechanical testing; microsensors; silicon; transparency; 0.5 to 100 mum; DNA analysis instrumentation; Si; Si substrate; batch lithographic process; bioanalysis chips; biocompatibility tests; bonded structures; fabrication; fluidic components; glass; mechanical tests; microfluidic plastic capillaries; micromoulding; planar substrates; planarization; plastic capillaries; plastic components; polycarbonate wafers; polysilicon; testing; Biomedical optical imaging; Bonding; Circuit testing; DNA; Fabrication; Glass; Microfluidics; Planarization; Plastics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
  • Conference_Location
    Nagoya
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-3744-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1997.581840
  • Filename
    581840