Title :
Using SPICE to calculate MOSFET operating temperature
Author_Institution :
Dept. of Eng. Technol., Arkansas Univ., Little Rock, AR, USA
fDate :
29 Jun-3 Jul 1992
Abstract :
An analog behavioral SPICE model which allows the average temperature of the semiconductor chip of a MOSFET to be determined during a transient simulation is presented. The model is valid for simulation times of less than approximately that of the thermal time constant of the device, and has demonstrated excellent agreement with measured device temperatures. Thermal impedance data required by the model are available from manufacturers´ data sheets, so that the model requires no device measurements or characterization
Keywords :
SPICE; circuit analysis computing; digital simulation; insulated gate field effect transistors; semiconductor device models; thermal analysis; MOSFET operating temperature; SPICE; semiconductor chip; thermal impedance data; transient simulation; Equations; Impedance; MOSFET circuits; Power dissipation; SPICE; Semiconductor device manufacture; Semiconductor devices; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Power Electronics Specialists Conference, 1992. PESC '92 Record., 23rd Annual IEEE
Conference_Location :
Toledo
Print_ISBN :
0-7803-0695-3
DOI :
10.1109/PESC.1992.254787
