• DocumentCode
    3428821
  • Title

    Data transmission performance of an optical backboard bus

  • Author

    Itoh, Keiichiro ; Konno, Riyo ; Katagiri, Yoshitada ; Mikazuki, Tetsuo

  • Author_Institution
    NTT Interdisciplinary Res. Labs., Tokyo, Japan
  • fYear
    1995
  • fDate
    4-6 Dec 1995
  • Firstpage
    268
  • Lastpage
    271
  • Abstract
    The data transmission performance of a previously proposed high-speed optical backboard bus, whose transmission-signal waveforms are theoretically unchanged even when the number and placement of its package boards are changed, has been estimated. The proposed bus is composed of an 8×8 optical star coupler, optical fibers, optical-transmitter modules, and optical-receiver modules. These modules are grouped on an optical backboard attached to the back side of a plug-in unit for an existing backboard bus assembly. Data can be transmitted at up to 1 Gb/s, which is about ten times faster than electrical bus rates, with no errors, even when changing the package boards. The proposed bus is adaptable to multi-channel lower-rate data transmission by using multiplexers and demultiplexers on the package boards to change the transmission rate
  • Keywords
    demultiplexing equipment; multiplexing equipment; optical fibre couplers; optical interconnections; optical receivers; optical transmitters; printed circuit accessories; system buses; 1 Gbit/s; data buses; data transmission performance; demultiplexers; high-speed board interconnections; high-speed optical backboard bus; multi-channel lower-rate data transmission; multiplexers; optical fibers; optical star coupler; optical-receiver modules; optical-transmitter modules; package board placement; plug-in unit; transmission-signal waveforms; Connectors; Data communication; High speed optical techniques; Optical coupling; Optical fibers; Optical interconnections; Optical polymers; Optical transmitters; Packaging machines; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
  • Conference_Location
    Omiya
  • Print_ISBN
    0-7803-3622-4
  • Type

    conf

  • DOI
    10.1109/IEMT.1995.541042
  • Filename
    541042