Microactuated self-assembling of 3D polysilicon structures with reshaping technology

Author

Fukuta, Y. ; Collard, D. ; Akiyama, T. ; Yang, E.H. ; Fujita, H.

Author_Institution

Inst. of Ind. Sci., Tokyo Univ., Japan

fYear

1997

fDate

26-30 Jan 1997

Firstpage

477

Lastpage

481

Abstract

This abstract proposes and experimentally confirms the automatic self-assembling of 3D polysilicon structures, compatible with both mass production and IC based surface machining. This technique combines an integrated actuation based on the scratch drive actuator (SDA), for the structure raising up, and the reshaping technology to obtain the permanent 3D shapes. Complex 3D structures have been successfully realised and their electrostatic actuation have been obtained. This self-building capability of 3D devices from silicon surface micromachining opens new integration capabilities and new application field for MEMS

Keywords

deformation; electrostatic devices; elemental semiconductors; microactuators; microassembling; micromachining; semiconductor technology; silicon; 3D polysilicon structures; IC based surface machining; LPCVD; MEMS; Si; Si surface micromachining; automatic self-assembling; integrated actuation; mass production; microactuated self-assembling; permanent 3D shapes; reshaping technology; scratch drive actuator; Electrostatic actuators; Friction; Heat sinks; Machining; Mass production; Micromechanical devices; Plastics; Pulse measurements; Shape; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on

Conference_Location

Nagoya

ISSN

1084-6999

Print_ISBN

0-7803-3744-1

Type

conf

DOI

10.1109/MEMSYS.1997.581906

Filename

581906