• DocumentCode
    3429223
  • Title

    A packaged silicon MEMS vibratory gyroscope for microspacecraft

  • Author

    Tang, Tony K. ; Gutierrez, Roman C. ; Stell, Christopher B. ; Vorperian, Vatche ; Arakaki, Genji A. ; Rice, John T. ; Li, Wen J. ; Chakraborty, Indrani ; Shcheglov, Kirill ; Wilcox, Jaroslava Z. ; Kaiser, William J.

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    1997
  • fDate
    26-30 Jan 1997
  • Firstpage
    500
  • Lastpage
    505
  • Abstract
    In this paper, we present recent work on the design, fabrication, and packaging of a silicon Micro-Electro-Mechanical System (MEMS) microgyroscope designed for space applications. A hermetically sealed package that houses the microgyroscope and most of its control electronics has been built and tested. The entire microgyroscope package is approximately 1×1×0.7 inches in dimensions. The rest of the control electronics which includes the drive and lock-in amplifier circuitry are mounted outside the gyro box on a 1×1 inch circuit board. This packaged microgyroscope has a 7 Hz split between its drive and sense mode and has a scale factor of 24 mV/deg/sec, bias stability of 70 deg/hr, angle random walk of 6.3 deg/√hr, and a rate ramp of 0.2 deg/hr/sec. Recent improvements on the fabrication and assembly procedures and microgyroscope design have resulted in clover-leaf structures with matched drive and sense resonant frequency. These new structures have a very small temperature dependent frequency shift of 0.23 Hz/degree for both the drive and sense modes
  • Keywords
    angular velocity measurement; electric sensing devices; elemental semiconductors; gyroscopes; microsensors; semiconductor device packaging; silicon; space vehicle electronics; MEMS microgyroscope; Si; Si MEMS vibratory gyroscope; assembly procedures; clover-leaf structures; control electronics; design; drive; fabrication; hermetically sealed package; lock-in amplifier circuitry; matched drive; microgyroscope design; microspacecraft; packaging; sense resonant frequency; space applications; Amplifiers; Circuit testing; Electronic equipment testing; Electronics packaging; Fabrication; Gyroscopes; Hermetic seals; Microelectromechanical systems; Micromechanical devices; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
  • Conference_Location
    Nagoya
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-3744-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1997.581911
  • Filename
    581911