DocumentCode :
3429223
Title :
A packaged silicon MEMS vibratory gyroscope for microspacecraft
Author :
Tang, Tony K. ; Gutierrez, Roman C. ; Stell, Christopher B. ; Vorperian, Vatche ; Arakaki, Genji A. ; Rice, John T. ; Li, Wen J. ; Chakraborty, Indrani ; Shcheglov, Kirill ; Wilcox, Jaroslava Z. ; Kaiser, William J.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
1997
fDate :
26-30 Jan 1997
Firstpage :
500
Lastpage :
505
Abstract :
In this paper, we present recent work on the design, fabrication, and packaging of a silicon Micro-Electro-Mechanical System (MEMS) microgyroscope designed for space applications. A hermetically sealed package that houses the microgyroscope and most of its control electronics has been built and tested. The entire microgyroscope package is approximately 1×1×0.7 inches in dimensions. The rest of the control electronics which includes the drive and lock-in amplifier circuitry are mounted outside the gyro box on a 1×1 inch circuit board. This packaged microgyroscope has a 7 Hz split between its drive and sense mode and has a scale factor of 24 mV/deg/sec, bias stability of 70 deg/hr, angle random walk of 6.3 deg/√hr, and a rate ramp of 0.2 deg/hr/sec. Recent improvements on the fabrication and assembly procedures and microgyroscope design have resulted in clover-leaf structures with matched drive and sense resonant frequency. These new structures have a very small temperature dependent frequency shift of 0.23 Hz/degree for both the drive and sense modes
Keywords :
angular velocity measurement; electric sensing devices; elemental semiconductors; gyroscopes; microsensors; semiconductor device packaging; silicon; space vehicle electronics; MEMS microgyroscope; Si; Si MEMS vibratory gyroscope; assembly procedures; clover-leaf structures; control electronics; design; drive; fabrication; hermetically sealed package; lock-in amplifier circuitry; matched drive; microgyroscope design; microspacecraft; packaging; sense resonant frequency; space applications; Amplifiers; Circuit testing; Electronic equipment testing; Electronics packaging; Fabrication; Gyroscopes; Hermetic seals; Microelectromechanical systems; Micromechanical devices; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
ISSN :
1084-6999
Print_ISBN :
0-7803-3744-1
Type :
conf
DOI :
10.1109/MEMSYS.1997.581911
Filename :
581911
Link To Document :
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