Title :
High accuracy face down bonding with micro-ball alignment
Abstract :
Light edge emitting diode arrays are expected to be applied in optical writing units and optical transmission units. For a 63.5 μm-pitch electrode connection, we succeeded in forming solder bumps on semiconductor electrodes by aligning solder balls, and bonding this device by making reflow connections with a face-down bonding method. Using a micro-ball 25 μm in diameter, the connection was accurate to within ±2 μm. It was verified that the initial characteristics of the face-down bonded device are essentially the same as those of a face-up mounted device fabricated by wire bonding
Keywords :
arrays; flip-chip devices; integrated optoelectronics; light emitting diodes; microassembling; position control; reflow soldering; 25 mum; 63.5 mum; GaAs; LEDA chip; chip mounting; dot positioning accuracy; electrode connection; face down bonding; light edge emitting diode array; light emission pattern; micro-ball alignment; optical transmission units; optical writing units; reflow connections; reflow flip chips; semiconductor electrodes; solder ball alignment; solder bumps; Electrodes; Gallium arsenide; Light emitting diodes; Manufacturing; Optical arrays; Semiconductor diodes; Stimulated emission; Wafer bonding; Wire; Writing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541046
