DocumentCode
3429754
Title
Layout dependence effect on high speed CMOS transistor leakage current
Author
Tan, Philip Beow Yew ; Kordesch, Albert Victor ; Sidek, Othman
Author_Institution
Dept. of Integration & Device, Silterra Malaysia Sdn. Bhd., Malaysia
fYear
2005
fDate
20-21 Dec. 2005
Abstract
We investigated the layout dependence effect that is caused by different active space, Sa, on 130 nm CMOS transistors leakage current, Ioff. This layout dependence phenomenon is known as STI stress effect. The results show that when Sa changes from 5 μm to 0.34 μm, the NMOS Ioff decreases and the PMOS Ioff increases. The decrease of NMOS Ioff and increase of PMOS Ioff under compressive stress is similar to the trend of saturation current, Idsat but opposite the trend of linear threshold voltage, Vtlin. The layout dependence (or STI stress effect) not only affects the Vtlin and Idsat but also the Ioff of the 130 nm CMOS transistors.
Keywords
CMOS integrated circuits; MOSFET; integrated circuit layout; leakage currents; 130 nm; NMOS; PMOS; STI stress effect; high speed CMOS transistor; layout dependence effect; linear threshold voltage; transistor leakage current; CMOS technology; Compressive stress; Diodes; Electric variables; Fluctuations; Leakage current; MOS devices; Paper technology; Space technology; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Electromagnetics, 2005. APACE 2005. Asia-Pacific Conference on
Print_ISBN
0-7803-9431-3
Type
conf
DOI
10.1109/APACE.2005.1607834
Filename
1607834
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