Title :
Electrical parameter data analysis and object-oriented techniques in semiconductor process development
Author :
Freeman, G. ; Kierstead, J. ; Schweiger, W.
Author_Institution :
Adv. Semicond. Technol. Center, IBM Corp., USA
fDate :
29 Sep-1 Oct 1996
Abstract :
Early and rapid assessment regarding the outcome of process experiments on performance and integrity of fabricated devices is critical to the learning process inherent in process development. In-line electrical measurements on test structures play a critical role in this assessment. Interpretation and analysis of data generated from such measurements usually falls short of its potential because of the data storage/retrieval/calculation/and analysis tools available to those required to understand this data. At IBM´s Advanced Semiconductor Technology Center, we have taken advantage of object-oriented technologies to develop a system that solves these problems in a single integrated package. Central to this system is an object-oriented “data model” in which engineering domain objects (i.e.: Devices, Measurements, and Calculations) are represented and stored as database objects. This paper reviews the requirements for a parametric electrical database and analysis system, and describes the integral part that these modelled objects play in our implementation of the calculation and analysis routines. Real-life examples are drawn from the SiGe HBT technology supported by this system at the ASTC
Keywords :
data analysis; data structures; electronic engineering computing; integrated circuit manufacture; integrated circuit measurement; object-oriented databases; object-oriented methods; production engineering computing; SiGe; SiGe HBT technology; data model; electrical parameter data analysis; inline electrical measurements; object-oriented techniques; semiconductor process development; test structures; Data analysis; Data engineering; Electric variables measurement; Information retrieval; Memory; Object oriented databases; Object oriented modeling; Semiconductor device packaging; Silicon germanium; Testing;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 1996., Proceedings of the 1996
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-3516-3
DOI :
10.1109/BIPOL.1996.554145