DocumentCode
3430947
Title
Electrical parameter data analysis and object-oriented techniques in semiconductor process development
Author
Freeman, G. ; Kierstead, J. ; Schweiger, W.
Author_Institution
Adv. Semicond. Technol. Center, IBM Corp., USA
fYear
1996
fDate
29 Sep-1 Oct 1996
Firstpage
81
Lastpage
88
Abstract
Early and rapid assessment regarding the outcome of process experiments on performance and integrity of fabricated devices is critical to the learning process inherent in process development. In-line electrical measurements on test structures play a critical role in this assessment. Interpretation and analysis of data generated from such measurements usually falls short of its potential because of the data storage/retrieval/calculation/and analysis tools available to those required to understand this data. At IBM´s Advanced Semiconductor Technology Center, we have taken advantage of object-oriented technologies to develop a system that solves these problems in a single integrated package. Central to this system is an object-oriented “data model” in which engineering domain objects (i.e.: Devices, Measurements, and Calculations) are represented and stored as database objects. This paper reviews the requirements for a parametric electrical database and analysis system, and describes the integral part that these modelled objects play in our implementation of the calculation and analysis routines. Real-life examples are drawn from the SiGe HBT technology supported by this system at the ASTC
Keywords
data analysis; data structures; electronic engineering computing; integrated circuit manufacture; integrated circuit measurement; object-oriented databases; object-oriented methods; production engineering computing; SiGe; SiGe HBT technology; data model; electrical parameter data analysis; inline electrical measurements; object-oriented techniques; semiconductor process development; test structures; Data analysis; Data engineering; Electric variables measurement; Information retrieval; Memory; Object oriented databases; Object oriented modeling; Semiconductor device packaging; Silicon germanium; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting, 1996., Proceedings of the 1996
Conference_Location
Minneapolis, MN
ISSN
1088-9299
Print_ISBN
0-7803-3516-3
Type
conf
DOI
10.1109/BIPOL.1996.554145
Filename
554145
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