DocumentCode :
3431077
Title :
Thermal design considerations for Greek cross test structures
Author :
Enderling, S. ; Dicks, M.H. ; Smith, Samuel ; Stevenson, J.T.M. ; Walton, A.J.
Author_Institution :
Sch. of Eng. & Electron., Edinburgh Univ., UK
fYear :
2003
fDate :
17-20 March 2003
Firstpage :
8
Lastpage :
13
Abstract :
This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant Joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.
Keywords :
finite element analysis; integrated circuit design; integrated circuit testing; temperature distribution; voltmeters; Finite Element analysis software; Greek cross test structures; Joule heating; arm length; pad size; temperature rises; thermal design considerations; voltmeter; Analytical models; Current measurement; Finite element methods; Force measurement; Heating; Performance analysis; Software performance; Temperature sensors; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 2003. International Conference on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7653-6
Type :
conf
DOI :
10.1109/ICMTS.2003.1197361
Filename :
1197361
Link To Document :
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