• DocumentCode
    3431077
  • Title

    Thermal design considerations for Greek cross test structures

  • Author

    Enderling, S. ; Dicks, M.H. ; Smith, Samuel ; Stevenson, J.T.M. ; Walton, A.J.

  • Author_Institution
    Sch. of Eng. & Electron., Edinburgh Univ., UK
  • fYear
    2003
  • fDate
    17-20 March 2003
  • Firstpage
    8
  • Lastpage
    13
  • Abstract
    This paper analyses the temperature rises associated with the currents forced during the measurement of Greek cross test structures. Simulations were performed using Finite Element (FE) analysis software which indicated that the temperature can be dramatically reduced by decreasing the arm length and increasing the pad size of the Greek cross. Using these design rules it was practically confirmed that higher currents could be forced through Greek crosses without significant Joule heating. As a result the voltage sensed when the Greek cross is measured is increased making the resolution of the voltmeter a less important issue.
  • Keywords
    finite element analysis; integrated circuit design; integrated circuit testing; temperature distribution; voltmeters; Finite Element analysis software; Greek cross test structures; Joule heating; arm length; pad size; temperature rises; thermal design considerations; voltmeter; Analytical models; Current measurement; Finite element methods; Force measurement; Heating; Performance analysis; Software performance; Temperature sensors; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2003. International Conference on
  • Conference_Location
    Monterey, CA, USA
  • Print_ISBN
    0-7803-7653-6
  • Type

    conf

  • DOI
    10.1109/ICMTS.2003.1197361
  • Filename
    1197361