DocumentCode :
3431239
Title :
Evaluation of mechanical properties by electrostatic loading of polycrystalline silicon beams
Author :
Cambie, Rossana ; Carli, Fabio ; Combi, Chantal
Author_Institution :
Dept. of Electr. Eng., Pavia Univ., Italy
fYear :
2003
fDate :
17-20 March 2003
Firstpage :
3
Lastpage :
39
Abstract :
The main object of the paper is the implementation of two different approaches for the estimation of the modulus of elasticity and of the failure strain/stress in micro machined structures manufactured of epitaxial polycrystalline silicon (15/spl mu/m thick film). The micro-test-structures are produced using a standard THELMA process becoming an integral part of a MEMS actuator of comb-finger type. The micro-motor is designed to develop electrostatic in plane forces of desired intensity when fed by suitable electric potential difference.
Keywords :
elasticity; elemental semiconductors; failure analysis; microactuators; micromachining; silicon; MEMS actuator; Si; THELMA process; comb-finger type; electric potential difference; electrostatic in plane forces; electrostatic loading; epitaxial polycrystalline silicon; failure strain/stress; mechanical properties; micro machined structures; micro-motor; modulus of elasticity; polycrystalline silicon beams; Capacitive sensors; Elasticity; Electrostatics; Mechanical factors; Micromechanical devices; Molecular beam epitaxial growth; Pulp manufacturing; Silicon; Stress; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 2003. International Conference on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-7653-6
Type :
conf
DOI :
10.1109/ICMTS.2003.1197368
Filename :
1197368
Link To Document :
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