An integrated test chip for the complete characterization and monitoring of a 0.25μm CMOS technology that fits into five scribe line structures 150μm by 5000μm

Author

Lefferts, Robert ; Jakubiec, Chris

Author_Institution

Accelerant Networks, Beaverton, OR, USA

fYear

2003

fDate

17-20 March 2003

Firstpage

3

Lastpage

63

Abstract

A novel on-chip switch-matrix design, with integrated CBCM structures, enabled an entire test chip containing 340 test devices to be integrated into 5 scribe line test structures. Using full Kelvin sensing, the resulting structures provided improved accuracy over conventional test structure design. Each row has only 14 probe pads and contains either 75 MOS or 50 CV DUTs. This test chip was used to completely characterize a 0.25μm Mixed Signal CMOS process and then extended for 0.13μm CMOS technologies.

Keywords

CMOS integrated circuits; characteristics measurement; integrated circuit testing; mixed analogue-digital integrated circuits; 0.13 micron; 0.25 micron; 150 micron; 5000 micron; CMOS; DUTs; Mixed Signal process; characterization; full Kelvin sensing; integrated test chip; on-chip switch-matrix design; scribe line structures; test structure design; CMOS process; CMOS technology; Capacitance; Kelvin; Life testing; Monitoring; Probes; Ring oscillators; Space technology; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2003. International Conference on

Print_ISBN

0-7803-7653-6

Type

conf

DOI

10.1109/ICMTS.2003.1197382

Filename

1197382