Inkless process automation improvement on backend

Author

Huang, Alec ; Hu, Victor ; Chen, Rex ; Mao, Rui

Author_Institution

Macronix Int. Co. Ltd., Hsinchu, Taiwan

fYear

2002

fDate

10-11 Dec. 2002

Firstpage

127

Lastpage

131

Abstract

The evolution of the technique of the semiconductor industry changes with each passing day. The requirements for full process automation and cost reduction are also gradually becoming imperative. The assembly technique has moved from online ink to off-line ink, but these two techniques will still make some impacts on the wafer quality and increase the cost. Through our research, we have developed the "Inkless system". It significantly improves the degree of assembly automation and the quality of wafers, and also reduces a considerable the amount of cost, which satisfies the requirements for high yield rate and high business processing efficiency.

Keywords

assembling; cost reduction; materials handling; process design; real-time systems; semiconductor device manufacture; assembly automation; business processing efficiency; cost reduction; inkless process automation; mapping rules; off line ink; online ink; semiconductor industry; wafer bank; wafer quality; yield rate; Assembly; Automatic testing; Automation; Costs; Databases; Ink; Manufacturing processes; Packaging; Production facilities; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Technology Workshop, 2002

Print_ISBN

0-7803-7604-8

Type

conf

DOI

10.1109/SMTW.2002.1197391

Filename

1197391