• DocumentCode
    3431958
  • Title

    Scalable ground-shielded open fixture applied to de-embedding techniques

  • Author

    Kaija, Tero ; Ristolainen, Eero

  • Author_Institution
    Inst. of Electron., Tampere Univ. of Technol., Finland
  • fYear
    2003
  • fDate
    17-20 March 2003
  • Firstpage
    85
  • Lastpage
    90
  • Abstract
    To save die space, introducing scalability to de-embedding fixtures is essential. This paper introduces a way to apply scalable ground-shielded open fixture to de-embedding techniques. The de-embedding process can be carried out using only one ground-shielded open-fixture for several different-size DUTs. The validity of this proposed method that enables scalability has been verified by measurements and by applying it to commonly used de-embedding methods. Also the possibilities for bi-directional scaling are studied. Several sets of in-fixtures were fabricated using 0.35μm three-metal-layer CMOS technology.
  • Keywords
    CMOS integrated circuits; electromagnetic shielding; integrated circuit testing; radiofrequency integrated circuits; 0.35 micron; DUTs; bi-directional scaling; de-embedding techniques; die space; in-fixtures; radiofrequency integrated circuits; scalable ground-shielded open fixture; three-metal-layer CMOS; Bidirectional control; CMOS process; CMOS technology; Capacitance; Fixtures; Probes; Radio frequency; Scalability; Semiconductor device modeling; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2003. International Conference on
  • Print_ISBN
    0-7803-7653-6
  • Type

    conf

  • DOI
    10.1109/ICMTS.2003.1197406
  • Filename
    1197406