DocumentCode
3431958
Title
Scalable ground-shielded open fixture applied to de-embedding techniques
Author
Kaija, Tero ; Ristolainen, Eero
Author_Institution
Inst. of Electron., Tampere Univ. of Technol., Finland
fYear
2003
fDate
17-20 March 2003
Firstpage
85
Lastpage
90
Abstract
To save die space, introducing scalability to de-embedding fixtures is essential. This paper introduces a way to apply scalable ground-shielded open fixture to de-embedding techniques. The de-embedding process can be carried out using only one ground-shielded open-fixture for several different-size DUTs. The validity of this proposed method that enables scalability has been verified by measurements and by applying it to commonly used de-embedding methods. Also the possibilities for bi-directional scaling are studied. Several sets of in-fixtures were fabricated using 0.35μm three-metal-layer CMOS technology.
Keywords
CMOS integrated circuits; electromagnetic shielding; integrated circuit testing; radiofrequency integrated circuits; 0.35 micron; DUTs; bi-directional scaling; de-embedding techniques; die space; in-fixtures; radiofrequency integrated circuits; scalable ground-shielded open fixture; three-metal-layer CMOS; Bidirectional control; CMOS process; CMOS technology; Capacitance; Fixtures; Probes; Radio frequency; Scalability; Semiconductor device modeling; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2003. International Conference on
Print_ISBN
0-7803-7653-6
Type
conf
DOI
10.1109/ICMTS.2003.1197406
Filename
1197406
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