Title :
Scrap rules for small lots in wafer fabrication
Author :
Wu, Muh-Chemg ; Chiou, Chie-Wun ; Hsu, Hsi-Mei
Author_Institution :
Dept. of Ind. Eng. & Manage., Nat. Chiao Tung Univ., Hsic-Chu, Taiwan
Abstract :
This paper presents a genetic algorithm for determining the rules for scrapping small lots in a semiconductor fab. Small lots are lots which carry less than 25 wafers due to yield problem. Simulation results show that the proposed approach can increase contribution margin up to 24% in the case of low yield and high average selling price.
Keywords :
genetic algorithms; lot sizing; semiconductor device manufacture; wafer bonding; genetic algorithm; scrap rules; semiconductor fabrication; semiconductor manufacture; wafer fabrication; Costs; Decision making; Engineering management; Fabrication; Genetic algorithms; Industrial engineering; Optical wavelength conversion; Semiconductor device manufacture; Throughput; Workstations;
Conference_Titel :
Semiconductor Manufacturing Technology Workshop, 2002
Print_ISBN :
0-7803-7604-8
DOI :
10.1109/SMTW.2002.1197410
