Design and integration of electrical-based dimensional process-window checking infrastructure

Author

Doong, Kelvin Y Y ; Wang, Robin C J ; Huang, Jurcy C H ; Lin, S.C. ; Hung, L.J. ; Lee, S.Z. ; Young, K.L.

Author_Institution

Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan

fYear

2003

fDate

17-20 March 2003

Firstpage

103

Lastpage

106

Abstract

The purpose of this work is to provide a design infrastructure for electrical-based dimensional process-window checking. With the aid of the novel test vehicle design platform, the discrepancy among design rule set, test structure design and testing plan can be minimized. Using the function-independent Test Structure Design Intellectual Properties (TSD-IP) provided by this infrastructure, the process-window could be quantified as the electrical testing of test structures. A cross-generation (130 nm-90 nm) test vehicle which focuses on the evaluation of overlay and critical dimension variation across the intra- and inter-photo field is enacted to demonstrate the design framework.

Keywords

electronic design automation; industrial property; integrated circuit testing; system-on-chip; 130 to 90 nm; critical dimension variation; design rule set; electrical testing; electrical-based dimensional process-window checking infrastructure; function-independent Test Structure Design Intellectual Properties; inter-photo field; intra-photo field; overlay; test structure design; test vehicle design platform; testing plan; Automatic testing; Electronic equipment testing; Electrons; Intellectual property; Kelvin; Logic testing; Metrology; Semiconductor device measurement; System testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2003. International Conference on

Print_ISBN

0-7803-7653-6

Type

conf

DOI

10.1109/ICMTS.2003.1197423

Filename

1197423