Title :
A new encapsulating method for semiconductor devices using resin sheets
Author :
Ota, Hideo ; Fujieda, Shinetsu ; Okuyama, Tetsuo ; Yoshizumi, Akira
Author_Institution :
Lab. VII, Toshiba Corp., Kawasaki, Japan
Abstract :
This paper describes a new encapsulating method using resin sheets. In this method, uncured resin sheets are placed on both sides of semiconductor chip, and inserted into heated molds. The resin sheets placed on the chip are fused and fill up the mold cavity. Then the resin is cured. This method is very suitable for fabricating packages which are as thin as 0.3 mm. Such thin model packages achieved high reliability under pressure cooker test and thermal cycle test
Keywords :
encapsulation; environmental testing; integrated circuit packaging; integrated circuit reliability; 0.3 mm; encapsulating method; heated molds; mold cavity; pressure cooker test; reliability; semiconductor devices; thermal cycle test; uncured resin sheets; Electronic packaging thermal management; Encapsulation; Laboratories; Pressing; Resins; Semiconductor device packaging; Semiconductor devices; Temperature; Testing; Transfer molding;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541064
