The use of the FPC-laser method for different chip interconnection techniques

Author

Azdasht, G. ; Kasulke, P. ; Zakel, E. ; Reichl, Und H.

Author_Institution

Technologien der Mikroperipherik, Tech. Univ. Berlin, Germany

fYear

1995

fDate

4-6 Dec 1995

Firstpage

397

Lastpage

402

Abstract

The reproducibility of the laser connection within micro interconnection technology depends on the absorption quality of the contact material and the thermal interconnection. The Fibre Push Connection System (FPC) allows contacts of high reproducibility due to thermal contact between two parts and the high absorption of the laser energy by this system. The different applications of the FPC-System will be presented. The used metallurgy of contact parts are AuSn/Au and AuSn/Ni. The same machine concept is applied for flip chip on flexible substrates

Keywords

flip-chip devices; integrated circuit interconnections; laser materials processing; AuSn-Au; AuSn-Ni; FPC laser method; chip interconnection technology; energy absorption; fibre push connection system; flexible substrate; flip chip; metallurgy; thermal contact; Absorption; Bonding; Copper; Fiber lasers; Integrated circuit interconnections; Joining processes; Lead; Reproducibility of results; Soldering; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541071

Filename

541071