New packaging technology for SAW device

Author

Ando, Daizo ; Oishi, Kunihiko ; Nakamura, Tadashi ; Umeda, Sinji ; Yuzawa, Tetruo

Author_Institution

Corp. Components Dev. Centre, Matsushita Electron. Components Co. Ltd., Osaka, Japan

fYear

1995

fDate

4-6 Dec 1995

Firstpage

403

Lastpage

406

Abstract

A new hermetic seal package using glass wafers for surface acoustic wave (SAW) device was developed. Two glass wafers are used. Cavity and through hole are formed on each glass wafer by the grinding process. Two glass wafers are combined in atomic level by using the glass direct bonding technique. The SAW device chip is inserted into the cavity. Electrodes are taken out from through holes by solder balls without using wires. These technologies were applied to SAW resonator. The size of developed SAW resonator is 4.0×2.0×0.8 mm. The characteristics and reliability of developed SAW resonator were investigated. The characteristics degradation by packaging process was not observed. Insertion loss was improved due to wireless assembly, and the characteristics change after high temperature preservation test was extremely small because there is no resin in the glass package

Keywords

packaging; surface acoustic wave resonators; SAW resonator; cavity; direct bonding; glass wafer; grinding; hermetic seal package; high temperature preservation; insertion loss; reliability; solder ball; surface acoustic wave device; through hole; wireless assembly; Acoustic waves; Degradation; Electrodes; Glass; Hermetic seals; Packaging; Surface acoustic wave devices; Surface acoustic waves; Wafer bonding; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541072

Filename

541072