Title :
Mounting and packaging techniques for toroidal devices
Author :
Tischler, Harold
Author_Institution :
Torelco, Inc., Irvington, NJ, USA
Abstract :
Mounting and packaging methods have been developed to accomodate the many and diverse requirements of modern toroidal equipment. The majority of them fall into the following categories, which are discussed in detail: open frame-self mounting; open frame with mounting device and/or hardware (includes surface mount); cased and potted; and metal cans
Keywords :
packaging; cased toroidal devices; coils; metal cans; mounting techniques; open frame-self mounting; packaging techniques; potted toroidal devices; toroidal devices; toroidal equipment; Costs; Environmental economics; Hardware; Inductors; Lead; Packaging; Power generation economics; Power supplies; Switches; Wire;
Conference_Titel :
Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-0847-6
DOI :
10.1109/EEIC.1993.631068
