DocumentCode :
3432940
Title :
Test structures for analyzing the mechanisms of wafer chemical contaminant removal
Author :
Yan, J. ; Barnaby, H.J. ; Vermiere, B. ; Peterson, T. ; Shadman, F.
Author_Institution :
Chem. & Environ. Eng., Arizona Univ., Tucson, AZ, USA
fYear :
2003
fDate :
17-20 March 2003
Firstpage :
209
Lastpage :
213
Abstract :
An electrochemical sensor (trench device) is designed to measure wafer contaminant concentrations during ultra-pure water rinses. Electrical measurements on these structures enable the identification and modeling of the mechanisms of chemical contaminant removal from patterned and unpatterned wafers, thereby facilitating the reduction of rinse time and water consumption without sacrificing overall wafer cleanliness.
Keywords :
electrochemical sensors; integrated circuit measurement; isolation technology; surface cleaning; surface contamination; chemical contaminant removal mechanism identification; electrical measurements; electrochemical sensor trench device; modeling; rinse time reduction; test structures; ultrapure water rinses; wafer chemical contaminant removal mechanisms; wafer cleanliness; wafer contaminant concentrations; water consumption reduction; Chemical analysis; Chemical sensors; Cleaning; Design engineering; Electric variables measurement; Etching; Fabrication; Isolation technology; Pollution measurement; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 2003. International Conference on
Print_ISBN :
0-7803-7653-6
Type :
conf
DOI :
10.1109/ICMTS.2003.1197463
Filename :
1197463
Link To Document :
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