DocumentCode :
3433296
Title :
Coupling study of a rotary Capacitive Power Transfer system
Author :
Liu, Chao ; Hu, Aiguo Patrick ; Nair, Nirmal-Kumar C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Auckland, Auckland
fYear :
2009
fDate :
10-13 Feb. 2009
Firstpage :
1
Lastpage :
6
Abstract :
In this paper a new technology termed Capacitive Power Transfer (CPT) is investigated to achieve contactless power transfer. Compared to traditional Inductive Power Transfer (IPT) technology, the advantages of CPT include the ability to supply power through metal barriers, reducing standing power losses, and alleviating EMI (Electromagnetic Interference). Electric coupling is a key part in a CPT system as it dominates the maximum power transfer capacity and the performance of the system. Different applications can have very different coupling structures and power level requirements. This paper proposes two types of coupling structures, disk and cylinder, for a rotary CPT system application. The system frequency, maximum output power, and power losses based on the cylindrical structure which has a larger coupling capacitance are analyzed. Simulation and experimental studies are carried out to verify the proposed coupling configurations.
Keywords :
electromagnetic coupling; electromagnetic interference; power supplies to apparatus; EMI; contactless power transfer; cylindrical structure; electric coupling; electromagnetic interference; maximum output power; maximum power transfer capacity; metal barriers; rotary capacitive power transfer system; standing power losses; Capacitors; Chaos; Contacts; Couplings; Electromagnetic fields; Electromagnetic interference; Frequency; Magnetic fields; Power generation; Power supplies;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Technology, 2009. ICIT 2009. IEEE International Conference on
Conference_Location :
Gippsland, VIC
Print_ISBN :
978-1-4244-3506-7
Electronic_ISBN :
978-1-4244-3507-4
Type :
conf
DOI :
10.1109/ICIT.2009.4939623
Filename :
4939623
Link To Document :
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