Title :
Application of sandwich multilayer technology to MICs design
Author :
Kapitanova, P. ; Simme, A. ; Kholodnyak, D. ; Vendik, I.
Author_Institution :
Dept. of Microelectron. & Radio Eng., St. Petersburg Electrotechnical Univ., Russia
Abstract :
The sandwich multilayer technology as applied to design of microwave integrated circuits (MICs) is considered for the first time. Potential benefits for microwave applications are discussed. Implementation of various passive MIC components as sandwich multilayer structures is demonstrated. Design of a miniature bandpass filter and directional couplers for telecommunications is presented.
Keywords :
band-pass filters; microwave integrated circuits; multilayers; sandwich structures; waveguide couplers; MIC; directional couplers; microwave applications; miniature bandpass filter; sandwich multilayer technology; Band pass filters; Ceramics; Dielectric substrates; Directional couplers; Fabrication; Integrated circuit technology; Microwave devices; Microwave integrated circuits; Microwave technology; Nonhomogeneous media;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1608875
