Title :
An approach to analytical modeling of snapback in SOI devices
Author :
Huang, J.S.T. ; Kueng, J.S.
Author_Institution :
Honeywell Inc., Plymouth, MN, USA
Abstract :
The snapback effect in N channel SOI devices in which the drain to source breakdown voltage is less than the drain to body breakdown voltage is addressed. The purpose is to present an approach to snapback modeling based on nonlinear feedback mechanisms between impact ionization current, the body to source forward bias, the threshold voltage, and the drain current supplying carriers to enhance impact ionization. NMOS SOI devices with the body either tied to the source of floating are analyzed. As the gate voltage first increases and then decreases, the device first operates in the subthreshold region, then jumps abruptly to the strong inversion regime and finally jumps back to the subthreshold region of operation. The model results in transcendental feedback expressions. It is possible to obtain closed-form expressions for the device currents and voltages at the jump points
Keywords :
MOS integrated circuits; electric breakdown of solids; feedback; impact ionisation; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; NMOS SOI devices; SOI devices; Si-SiO2; body to source forward bias; closed-form expressions; drain current; drain to body breakdown voltage; drain to source breakdown voltage; impact ionization current; model; nonlinear feedback mechanisms; snapback; strong inversion regime; subthreshold region; threshold voltage; transcendental feedback expressions; Analytical models; Feedback loop; Hysteresis; Impact ionization; Intrusion detection; MOS devices; Predictive models; Solid state circuits; Threshold voltage; Transconductance;
Conference_Titel :
SOS/SOI Technology Conference, 1990., 1990 IEEE
Conference_Location :
Key West, FL
Print_ISBN :
0-87942-573-3
DOI :
10.1109/SOSSOI.1990.145686