Novel intelligent power modules for low-power inverters

Author

Majumdar, G. ; Hussein, K.H. ; Iwasaki, M. ; Kawafuji, H. ; Iwagami, T. ; Yoshida, H.

Author_Institution

Mitsubishi Electr. Corp., Fukuoka City, Japan

Volume

2

fYear

1998

fDate

17-22 May 1998

Firstpage

1173

Abstract

In this paper, a series of newly developed intelligent power modules, designed for low power applications (up to 2.2 kW/220-240 V AC) is introduced. The modules are based on two distinct and novel design concepts related to increased integrated functionality and compact housing (packaging). The key technologies utilized are IGBT and diode chip technologies for power functions, control IC technology and module manufacturing and packaging technologies for smart housing of these new modules. The paper describes details of their design and functional capabilities, and projects on future possibilities based on the developed technologies

Keywords

DC-AC power convertors; insulated gate bipolar transistors; integrated circuit packaging; invertors; power bipolar transistors; power integrated circuits; 2.2 kW; 220 to 240 V; IGBT; compact housing; control IC technology; design concepts; diode chip technologies; integrated functionality; intelligent power modules; low-power inverters; module manufacturing; packaging; packaging technologies; power functions; smart housing; Artificial intelligence; Cities and towns; Design engineering; Insulated gate bipolar transistors; Multichip modules; Packaging; Power engineering and energy; Pulse width modulation; Pulse width modulation inverters; Servomechanisms;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 1998. PESC 98 Record. 29th Annual IEEE

Conference_Location

Fukuoka

ISSN

0275-9306

Print_ISBN

0-7803-4489-8

Type

conf

DOI

10.1109/PESC.1998.703153

Filename

703153