Title :
A copper alloy development for leadframe
Author :
Tomioka, Yasuo ; Miyake, Junji
Author_Institution :
Kurami Works, Nippon Min. & Metals Co. Ltd., Kanagawa, Japan
Abstract :
Technical requirements for leadframe material with the trends in packaging technology such as shrink in size and increasing heat dissipation are first summarized. A new precipitation hardening leadframe copper alloy which meets technical requirements is then introduced in terms of advantages related with package reliability
Keywords :
copper alloys; packaging; precipitation hardening; copper alloy; heat dissipation; leadframe; packaging; precipitation hardening; reliability; Assembly; Chemicals; Chromium alloys; Conducting materials; Copper alloys; Etching; Lead compounds; Packaging; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541079
