Title :
Recombination lifetime measurements in SOI materials using a depletion-mode MOSFET
Author :
Vu, D.P. ; Henderson, W.R. ; Zavracky, P.M. ; Cheong, N.K.
Author_Institution :
Kopin Corp., Taunton, MA, USA
Abstract :
The authors measured recombination lifetime in SOI by using a depletion-mode MOSFET. The drain-source current transient of depletion-mode MOSFETs when a reversed step bias is applied to the gate is studied at elevated temperatures. A theoretical analysis is performed by considering the different generation processes as functions of temperature. At high temperature, the minority carriers required for the inversion charge come mainly from the quasi-neutral region beneath the depletion region and from the nearby Si film-buried oxide interface through a generation-diffusion process; generation from the depletion region is neglected as well as the generation from the front gate interface. This analysis leads to a determination of a function containing the drain-source current varying linearly with time
Keywords :
carrier lifetime; elemental semiconductors; insulated gate field effect transistors; minority carriers; semiconductor-insulator boundaries; silicon; SOI materials; Si-SiO2; depletion-mode MOSFET; drain-source current transient; generation-diffusion process; minority carriers; recombination lifetime measurements; reversed step bias; Bipolar transistors; Breakdown voltage; Diffusion processes; MOSFET circuits; Performance analysis; Semiconductor films; Temperature; Testing; Time measurement; Voltage measurement;
Conference_Titel :
SOS/SOI Technology Conference, 1990., 1990 IEEE
Conference_Location :
Key West, FL
Print_ISBN :
0-87942-573-3
DOI :
10.1109/SOSSOI.1990.145712