• DocumentCode
    3434157
  • Title

    Design and Testing of an Integrated Circuit for Multi-Electrode Neural Recording

  • Author

    Harrison, Reid R. ; Watkins, Paul T. ; Kier, Ryan J. ; Black, Daniel J. ; Lovejoy, Robert O. ; Normann, Richard A. ; Solzbacher, Florian

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Utah Univ., Salt Lake City, UT
  • fYear
    2007
  • fDate
    6-10 Jan. 2007
  • Firstpage
    907
  • Lastpage
    912
  • Abstract
    The authors have developed a single-chip neural recording system with wireless power delivery and telemetry. The 0.5-mum CMOS IC is designed to be bonded to the back of a 100-channel Utah electrode array. A pad near each amplifier allows connection of the chip to the MEMS electrode array. The complete integrated neural interface receives power wirelessly through a 2.64-MHz inductive link. A clock, regulated supply, and commands are derived from the power signal .The neural amplifiers each have a gain of 60 dB. A 10-bit charge-redistribution ADC is used to digitize the signal from one amplifier selected with an analog MUX. Digitizing all channels simultaneously would generate prohibitively high data rates; therefore, the authors perform data reduction by incorporating one-bit "spike detectors" into each amplifier. Neural data is transmitted off chip using an integrated 433-MHz FSK transmitter. The chip measures 4.7 times 5.9 mm and consumes 13.5 mW of power
  • Keywords
    CMOS integrated circuits; analogue-digital conversion; integrated circuit design; integrated circuit testing; micromechanical devices; neural chips; telemetry; 0.5 micron; 1 bit; 10 bit; 13.5 mW; 2.64 MHz; 433 MHz; 60 dB; CMOS integrated circuit; MEMS electrode array; Utah electrode array; analog MUX; charge-redistribution ADC; data reduction; inductive link; integrated FSK transmitter; integrated circuit design; integrated circuit testing; integrated neural interface; multielectrode neural recording; neural amplifiers; spike detectors; telemetry; wireless power delivery; Bonding; CMOS integrated circuits; Circuit testing; Clocks; Electrodes; Gain; Integrated circuit testing; Micromechanical devices; Power amplifiers; Telemetry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2007. Held jointly with 6th International Conference on Embedded Systems., 20th International Conference on
  • Conference_Location
    Bangalore
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-2762-0
  • Type

    conf

  • DOI
    10.1109/VLSID.2007.63
  • Filename
    4092156