Laser personalization of interconnection arrays for hybrid ASICs

Configurable interconnection arrays for wafer scale integration (WSI) constitute an application for thin-film multichip modules (MCMs) based on silicon. Laser-formed vertical links allow short cycle times and introduce redundancy into the MCSi (multichip on silicon) technique. As personalization is performed after complete wafer processing, large-volume manufacturing without individual process steps is possible. Laser process parameters developed for a standard CMOS double-level metallization are adapted to a double-level sandwich metallization. Burn-in measurements are carried out with currents up to 150 mA. Laser contacts are found to be suitable for different standard double-level metallizations and for configuration of interconnection arrays.