Title :
Laser personalization of interconnection arrays for hybrid ASICs
Author :
Burnus, M. ; Taddiken, H. ; Hartmann, H.-D. ; Hillmann-Ruge, T.
Author_Institution :
Lab. for Informationstechnol., Hannover Univ., Germany
Abstract :
Configurable interconnection arrays for wafer scale integration (WSI) constitute an application for thin-film multichip modules (MCMs) based on silicon. Laser-formed vertical links allow short cycle times and introduce redundancy into the MCSi (multichip on silicon) technique. As personalization is performed after complete wafer processing, large-volume manufacturing without individual process steps is possible. Laser process parameters developed for a standard CMOS double-level metallization are adapted to a double-level sandwich metallization. Burn-in measurements are carried out with currents up to 150 mA. Laser contacts are found to be suitable for different standard double-level metallizations and for configuration of interconnection arrays.
Keywords :
application specific integrated circuits; hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; laser beam applications; metallisation; multichip modules; thin film circuits; Si circuit board; WSI; double-level sandwich metallization; hybrid ASICs; interconnection arrays; large-volume manufacturing; laser formed vertical links; laser personalisation; multichip modules; thin film MCM; wafer processing; wafer scale integration; CMOS process; Current measurement; Manufacturing processes; Metallization; Multichip modules; Optical arrays; Semiconductor thin films; Silicon; Standards development; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255245
