DocumentCode
3434306
Title
An advanced version of the electrically programmable hybrid-WSI substrate
Author
Stopper, Herbert
Author_Institution
Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
fYear
1993
fDate
1993
Firstpage
289
Lastpage
298
Abstract
The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.
Keywords
VLSI; hybrid integrated circuits; integrated circuit technology; multichip modules; packaging; substrates; antifuse; electrically programmable interconnection wafer; hybrid-WSI substrate; multichip modules; thin-film transmission line; wafer scale integration; Active circuits; Electrodes; Fuses; Integrated circuit interconnections; Leakage current; Power transmission lines; Resistors; Robustness; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-0867-0
Type
conf
DOI
10.1109/ICWSI.1993.255249
Filename
255249
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