DocumentCode
3434397
Title
A comparative study of clock distribution approaches for WSI
Author
Nigam, Nitin ; Keezer, D.C.
Author_Institution
Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
fYear
1993
fDate
1993
Firstpage
243
Lastpage
251
Abstract
Five different designs for a hypothetical five-inch wafer with an array of 8*8 cells are presented. The networks are simulated using HSPICE for comparison of power dissipation, delay, and skew. It is found that the large physical dimensions of a wafer scale system require that the signal interconnections be treated as transmission lines with finite delays in order to provide an accurate simulation of the signal wave shapes and timing. When clock distributions networks are compared, it is found that for a given power budget a tradeoff between delay and skew can be made. If a total power budget is established for the clock distribution network, then the five methods can be compared as to signal propagation delays and skew.
Keywords
SPICE; VLSI; circuit analysis computing; clocks; delays; digital integrated circuits; timing circuits; 5 in; HSPICE; WSI; clock distributions networks; power dissipation; signal interconnections; signal propagation delays; signal wave shapes; simulation; skew; timing; total power budget; transmission lines; wafer scale system; Circuit simulation; Clocks; Delay lines; Integrated circuit interconnections; Microelectronics; Minimization; Power dissipation; Power system interconnection; Power transmission lines; Propagation delay;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-0867-0
Type
conf
DOI
10.1109/ICWSI.1993.255254
Filename
255254
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