Title :
Characterization of piezoelectric ring used for wire bonding transducer application
Author :
Cheng, Kei Chun ; Chan, Helen Lai Wah
Author_Institution :
Dept. of Appl. Phys., Hong Kong Polytech. Univ., Kowloon, China
Abstract :
Resonant vibration modes excited in a piezoelectric PZT ring which are closely related to its geometry and dimensions were studied. By a thinning test of the ring, the electromechanical properties of the ring were measured as a function of its thickness and shifts in resonance vibrations were noted. Ring thickness was also optimized in relation to the electromechanical performance of the ring used for wire bonding applications
Keywords :
dielectric resonance; electron device testing; lead bonding; lead compounds; piezoelectric transducers; ultrasonic bonding; vibrations; PZT; PbZrO3TiO3; electromechanical performance; electromechanical properties; piezoelectric PZT ring; piezoelectric ring; resonance vibration shifts; resonant vibration modes; ring dimensions; ring geometry; ring thickness optimization; ring thinning test; wire bonding applications; wire bonding transducer application; Bonding; Fabrication; Packaging; Physics; Piezoelectric transducers; Powders; Resonance; Resonant frequency; Vibration measurement; Wire;
Conference_Titel :
Electron Devices Meeting, 2001. Proceedings. 2001 IEEE Hong Kong
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6714-6
DOI :
10.1109/HKEDM.2001.946919
