• DocumentCode
    3434510
  • Title

    Fault tolerance in a wafer scale environment

  • Author

    Pelletier, R.V. ; Blight, D.C. ; McLeod, R.D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    173
  • Lastpage
    184
  • Abstract
    Methods of improving the probability that a message can be passed from one side of a wafer to another are presented. This is achieved by increasing the number of usable processors in the system or, in other words, lowering the percolation threshold. The impact of several underlying topologies is discussed in terms of a percolation theory framework. Also presented are new routing techniques for message passing in wafer scale integration (WSI) processor arrays. The algorithms forego the shortest path route so as to avoid faulty and congested areas of the network. They are based on a biased random walker approach where the direction each packet travels is determined locally at each processor by a nondeterministic algorithm and a set of bias values. A practical application motivated by improved connectivity in multichip modules is introduced. This method allows for a reconfigurable wafer backplane that provides advantages in bypassing faulty lines in the wafer.
  • Keywords
    VLSI; fault tolerant computing; message passing; microprocessor chips; multichip modules; parallel architectures; biased random walker approach; connectivity; message passing; multichip modules; nondeterministic algorithm; percolation theory framework; percolation threshold; probability; reconfigurable wafer backplane; routing techniques; usable processors; wafer scale environment; Backplanes; Fault tolerance; Fault tolerant systems; Guidelines; Message passing; Nearest neighbor searches; Routing; Semiconductor device modeling; Topology; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-0867-0
  • Type

    conf

  • DOI
    10.1109/ICWSI.1993.255261
  • Filename
    255261