DocumentCode
3434586
Title
Application opportunities for hybrid-WSI
Author
Ming, Douglas R. ; Scannell, Robert K.
Author_Institution
Rockwell Int. Corp., Anaheim, CA, USA
fYear
1993
fDate
1993
Firstpage
129
Lastpage
135
Abstract
The performance, small size, and potentially lower cost of wafer scale integration (WSI) offers opportunities currently not being addressed optimally. In many data processing situations, data are recorded on site at the sensor input while the processing of the data is done at a remote site. With the advantages of WSI, data processing can be brought out of the laboratory and into the field. Thus real-time data analysis can be achieved, while also reducing costs and improving efficiency. A description is given of some of the first applications, namely, interceptor processors for avionics.
Keywords
VLSI; aircraft instrumentation; hybrid integrated circuits; microprocessor chips; avionics; efficiency; interceptor processors; real-time data analysis; wafer scale integration; Assembly; Circuit testing; Cost function; Data analysis; Data processing; Laboratories; Reconnaissance; Silicon; Vehicles; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-7803-0867-0
Type
conf
DOI
10.1109/ICWSI.1993.255265
Filename
255265
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